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Bundled Systems
:: 3D IR Visible
:: Gimbaled
:: Aircraft
:: Transport

3D Cameras
:: Portable
:: Breadboard
:: Flashlamp
:: Miniature
:: Underwater
:: Super-high resolution

Laser Transmitters
:: Air Cooled
:: Heat-pipe
:: Flashlamp
:: Transmitter and Filters

Receiver Optics
:: 17mm f1
:: 85mm f1
:: 250mm f2
:: 500mm f4
:: 750mm f8
:: 1800mm f22
:: Visible
:: Custom Optics

Custom Readout ICs
:: Detectors
:: Custom Readouts
:: Wafer Level Testing

Support
::
FAQ

Applications
::
Data

References
::
Papers

Wafer Level Testing
The readout integrated circuits (ROIC’s) are designed and laid out at the ASC facility. The ROIC’s are fabricated on very thin silicon wafers at a foundry. These wafers are then screened and tested for wafer die functionality and operability. Wafer testing is the first level of screening in the sequence of many to insure a viable working sensor. Each and every readout die on the wafer is tested and graded for the next stage of assembly. ASC’s wafer probe station has custom electronics built into it to accommodate the stringent requirements performed in this test.

Wafer Level Testing

Hybrid Level Testing
Selected ROIC’s are hybridized to selected detectors through the process of Indium bump bonding. Indium bumps form the electrical connection between readout input circuitry for each data pixel and its associated detector pixel. As an example, for a 128 by 128 sensor array there are over sixteen thousand interconnects. The readout and detector hybrid is then wire bonded to a special printed circuit (PC) board. This PC board is electrically connected to other dedicated system boards that control the flow of information entering and leaving the sensor hybrid. A dedicated laptop computer is connected to these system boards to orchestrate the retrieval and display of sensor data. The hybrid sensor is rigorously tested for basic operability and radiometrics through software loaded in laptop computer.

All systems shown are available for purchase.
For sales and pricing information, please contact us

 

     

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